Capability. Speed. Support.
PhotoLink technology’s inherent simplicity allows customers to easily integrate the coating process into their existing manufacturing lines. The entire process involves a minimal number of steps, and is versatile and substrate-friendly. The entire activation stage takes only seconds-to-minutes of exposure to ultraviolet light to accomplish the chemical bonding reaction at the surface.
PhotoLink technology uses no harsh chemicals and produces no hazardous byproducts. There is no need for surface pretreatment that can often affect a device’s physical properties. Curing times are measured in seconds, so the throughput is measured as “parts-per-minute" rather than "hours-per-part”.
With PhotoLink chemistry, capital equipment investment is generally low. No expensive environmental equipment, vacuum-control equipment, or time-consuming curing ovens are required. The technology adapts well to either batch processing or incorporation into continuous flow lines for high-volume and/or just-in-time processing. Inspections can be done online for early feedback on coating performance, which allows for better quality control and early problem detection, thereby reducing the potential for scrap. The PhotoLink process maintains consistent predictable outcomes, eliminating lot-to-lot variability.
